How heat and humidity affect no-clean paste - Fluctuations in temperature and humidity can diminish the performance of no-clean solder paste

摘要

As electronics manufacturing shifts from the United States to other countries, environmental issues such as temperature and humidity control are influencing the assembly process. When qualifying solder paste for domestic assembly lines, engineers rarely test the material's performance in hot, humid conditions. That's because these factors are usually tightly controlled within the manufacturing facility.