ELECTRIC COPPER PLATING SOLUTION FOR FLEXIBLE WIRING BOARD AND METHOD OF PRODUCING LAMINATE PRODUCED BY THE ELECTRIC COPPER PLATING SOLUTION

摘要

PROBLEM TO BE SOLVED: To provide an electric copper plating solution allowing for formation of a copper coating film having little ruggedness and high surface smoothness and allowing for manufacturing of a flexible wiring board having small electrolysis consumption and small warpage or twist and high dimensional stability.SOLUTION: The electric copper plating solution for a flexible wiring board is provided which contains copper sulfate, sulfuric acid, chlorine and an additive, and in which the additive contains a copolymer of diallyldialkylammonium chloride and sulfur dioxide, a copolymer of polyethylene glycol and polypropylene glycol, polyethylene glycol and bis(3-sulfopropyl)disulfide.SELECTED DRAWING: None