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A Monitoring Method of Additives in a Copper Sulfate Plating Solution Using a Near-Field Optical Sensor

机译：近场光学传感器铜硫酸铜电镀液中添加剂的监测方法

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Makoto FUJIMAKI; Koutaro SATO; Yoshimichi OHKI;
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1. Electroless Nickel Plating Aqueous Solution Containing Additive Ammonium Chloride to Fabricate a Near-Field Optical Probe with a Tip Protruding from Nickel Film [J] . Shuji Mononobe, Motoichi Ohtsu Japanese journal of applied physics . 2007,第9BPt1期

机译：含添加氯化铵的化学镀镍水溶液可制备具有从镍膜突出的尖端的近场光学探针
2. Corrosion of Copper in Acid-Sulfate Plating Baths with Additives [J] . D. Hua, D. Barkey Plating & Surface Finishing . 2003,第7期

机译：含添加剂的硫酸盐电镀液中铜的腐蚀
3. Quenching characteristics of bathocuproinedisulfonic acid, disodium salt in aqueous solution and copper sulfate plating solution [J] . Koga Toshiaki, Hirakawa Chieko, Takeshita Michinori, Japanese journal of applied physics . 2018,第4S期

机译：浴铜素二磺酸，二钠盐水溶液和硫酸铜镀液的淬火特性
4. Role of Additives in the Bright Copper Plating from Acid Copper Sulfate Bath and the History oInvited Talk [C] . M.Yokoi, T.Hayashi The Meeting of the Electrochemical Society . 2003

机译：添加剂在耐铜硫酸盐浴中的作用与历史oinvited谈话
5. Monte Carlo simulations of the electrodeposition of copper from a sulfate solution in the presence of additives. [D] . Pricer, Timothy James. 2000

机译：添加剂存在下硫酸盐溶液中铜电沉积的蒙特卡洛模拟。
6. An Investigation on Design and Characterization of a Highly Selective LED Optical Sensor for Copper Ions in Aqueous Solutions [O] . Sheng-Chun Hung, Chih-Cheng Lu, Yu-Ting Wu 2021

机译：水溶液中铜离子高选择性LED光学传感器的设计与表征研究
7. Control of additives to through-hole copper sulfate plating bath by utilization of CVS method. [O] . Shigeru YAMATO, Mitsuaki TADAKOSHI 1988

机译：通过利用CVS方法对通过孔铜硫酸铜电镀浴的添加剂。
8. Electrochemical control of brightener in acid copper sulfate plating solutions. Final report. [R] . Bronson, M. J., Hawley, M. D. 1990

机译：酸性硫酸铜电镀液中光亮剂的电化学控制。总结报告。

A Monitoring Method of Additives in a Copper Sulfate Plating Solution Using a Near-Field Optical Sensor

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