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Etching solution for multilayer film, etching concentrated solution, and etching method

机译:多层膜蚀刻液,蚀刻浓缩液及蚀刻方法

摘要

When an etchant that alone can etch a multilayer film comprising a copper layer and a molybdenum layer is used during mass production, it is important for the cross-sectional shape of an edge after etching to satisfy the shape requirement of having a forward taper without an undercut, and that no precipitate be formed in the etchant. A multilayer-film etchant containing a copper layer and a molybdenum layer contains hydrogen peroxide, an inorganic acid, an acidic organic acid, a neutral organic acid, an amine compound, and a hydrogen peroxide decomposition inhibitor, but not an azole compound; therefore, no reaction products are generated from a reaction with the hydrogen peroxide, and no precipitates form in the etchant. Furthermore, the cross-sectional shape of the edge after etching can be formed into a desirable forward tapering shape. Containing no phosphorus compounds or fluorine compounds, the etchant will case minimal damage to the environment when disposed.
机译:当在批量生产期间使用仅能蚀刻包括铜层和钼层的多层膜的蚀刻剂时,对于蚀刻后的边缘的横截面形状满足具有正锥度而无锥度的形状要求是重要的。底切,并且在蚀刻剂中不会形成沉淀。包含铜层和钼层的多层膜蚀刻剂包含过氧化氢,无机酸,酸性有机酸,中性有机酸,胺化合物和过氧化氢分解抑制剂,但不包含唑化合物。因此,与过氧化氢的反应不会产生反应产物,并且在蚀刻剂中不会形成沉淀。此外,可以将蚀刻后的边缘的截面形状形成为期望的正锥形。不含磷化合物或氟化合物,蚀刻剂在处置时对环境的损害最小。

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