首页>
外国专利>
Etching solution for multilayer film, etching concentrated solution, and etching method
Etching solution for multilayer film, etching concentrated solution, and etching method
展开▼
机译:多层膜蚀刻液,蚀刻浓缩液及蚀刻方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
In an etchant that etches a multilayer film of a copper layer and a molybdenum layer with a single solution, the cross-sectional shape of the edge after etching is deposited in the etchant with a geometrical requirement that there is no undercut and a forward taper. It is important that no product is generated when used in mass production. Etching solution for multilayer film containing hydrogen peroxide, inorganic acid, acidic organic acid, neutral organic acid, amine compound, copper layer containing hydrogen peroxide decomposition inhibitor and molybdenum layer contains azole compound Therefore, no reaction product is generated with hydrogen peroxide, and no precipitate is generated in the etching solution. In addition, the cross-sectional shape of the edge after etching can be a preferable forward tapered shape. Furthermore, since it does not contain phosphorus compounds or fluorine compounds, it has a light environmental impact during disposal.
展开▼