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Etching solution for multilayer film, etching concentrated solution, and etching method

机译:多层膜蚀刻液,蚀刻浓缩液及蚀刻方法

摘要

In an etchant that etches a multilayer film of a copper layer and a molybdenum layer with a single solution, the cross-sectional shape of the edge after etching is deposited in the etchant with a geometrical requirement that there is no undercut and a forward taper. It is important that no product is generated when used in mass production. Etching solution for multilayer film containing hydrogen peroxide, inorganic acid, acidic organic acid, neutral organic acid, amine compound, copper layer containing hydrogen peroxide decomposition inhibitor and molybdenum layer contains azole compound Therefore, no reaction product is generated with hydrogen peroxide, and no precipitate is generated in the etching solution. In addition, the cross-sectional shape of the edge after etching can be a preferable forward tapered shape. Furthermore, since it does not contain phosphorus compounds or fluorine compounds, it has a light environmental impact during disposal.
机译:在用单一溶液蚀刻铜层和钼层的多层膜的蚀刻剂中,蚀刻后的边缘的横截面形状沉积在蚀刻剂中,其几何学上要求没有底切和正锥度。重要的是,用于大规模生产时不会产生任何产品。用于含有过氧化氢,无机酸,酸性有机酸,中性有机酸,胺化合物,含有过氧化氢分解抑制剂的铜层和含有唑化合物的钼层的多层膜的蚀刻溶液,因此,过氧化氢不产生反应产物,也没有沉淀。在蚀刻溶液中产生。另外,蚀刻后的边缘的截面形状可以是优选的正锥形。此外,由于它不含磷化合物或氟化合物,因此在处理过程中对环境的影响很小。

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