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Shape-retaining film and shape-retaining flexible wiring board provided with the shape-retaining film

机译:保形膜及具备该保形膜的保形挠性电路板

摘要

An object of the present invention is to provide a shape-holding film that can be held in a deformed state by bending the flexible wiring board and the like, and a shape-holding flexible wiring board including the shape-holding film. The shape-retaining film 1 includes a plastically deformable metal layer 3 and an adhesive layer 4 that is formed on one side (lower side) of the metal layer 3 and bonded to the flexible wiring board 8. . The shape holding film 1 can hold the shape of the flexible wiring board 8 in a deformed state. Thereby, repulsive force can be prevented from being generated in the deformed flexible wiring board 8.
机译:本发明的目的在于提供一种能够通过使挠性电路板等弯曲而保持在变形状态的形状保持膜以及包括该形状保持膜的形状保持挠性电路板。形状保持膜1包括可塑性变形的金属层3和形成在金属层3的一侧(下侧)并粘合到柔性布线板8的粘合层4。形状保持膜1可以将挠性电路板8的形状保持在变形状态。由此,可以防止在变形的挠性电路板8中产生排斥力。

著录项

  • 公开/公告号JPWO2014192490A1

    专利类型

  • 公开/公告日2017-02-23

    原文格式PDF

  • 申请/专利权人 タツタ電線株式会社;

    申请/专利号JP20150519752

  • 发明设计人 田島 宏;

    申请日2014-04-30

  • 分类号H05K1/02;H05K9;

  • 国家 JP

  • 入库时间 2022-08-21 13:54:14

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