首页> 外国专利> Blackened surface-treated copper foil, method for producing blackened surface-treated copper foil, copper-clad laminate and flexible printed wiring board

Blackened surface-treated copper foil, method for producing blackened surface-treated copper foil, copper-clad laminate and flexible printed wiring board

机译:发黑的表面处理过的铜箔,制造发黑的表面处理过的铜箔的方法,覆铜层压板和挠性印刷线路板

摘要

Equipped with a blackened surface capable of improving CCD visibility and AOI inspection accuracy of flexible printed wiring boards in terminal connection processing, with appropriate roughness suitable for manufacturing flexible printed wiring boards, and good etching It aims at provision of the copper foil for printed wiring boards provided with a characteristic. In order to achieve this object, in the surface-treated copper foil provided with the roughened surface, the roughened surface has a maximum waviness difference (Wmax) of 1.2 μm or less, and an L * a * b * color system. A blackened surface-treated copper foil or the like for manufacturing a flexible printed wiring board, which is a black roughened surface having a lightness L * of 30 or less, is employed.
机译:具备能够提高端子连接加工中的挠性印刷电路板的CCD可视性和AOI检查精度的发黑面,具有适合于制造挠性印刷电路板的适当的粗糙度和良好的蚀刻性的目的在于提供印刷电路板用铜箔具有特点。为了实现该目的,在具有粗糙面的表面处理铜箔中,粗糙面的最大波纹度差(Wmax)为1.2μm以下,并且具有L * a * b *色系。使用用于制造柔性印刷线路板的经黑化的表面处理的铜箔等,其为亮度L *为30或更小的黑色粗糙化表面。

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