Metal particulate composition, the bonding material, an electronic component, a method of forming a bonding layer, the conductive layer forming method and an ink composition

摘要

PROBLEM TO BE SOLVED: To provide an ink composition which is usable in production of an electronic component, etc. and is dispersed stably with a metal fine particle.;SOLUTION: A metal fine particle composition contains A) a metal fine particle containing 50 pts.wt. of nickel element, at least 90 wt.% of metal elements and an average particle size of primary particles of 50-150 nm, B) a solvent of a boiling point of 190-280°C and C) an ester compound of a molecular weight of 100-500 having, independently, a 1-6C alkyl group or an optionally substituted phenyl or benzyl group.;COPYRIGHT: (C)2014,JPO&INPIT