METAL INK COMPOSITION CAPABLE OF MANUFACTURING A CONDUCTIVE METAL LAYER HAVING EXCELLENT ADHESION WITH A SUBSTRATE, A FORMING METHOD OF A CONDUCTIVE METAL LAYER USING THE SAME, AND A CONDUCTIVE METAL LAYER

摘要

PURPOSE: A metal ink composition is provided to have excellent adhesion with a substrate even by addition of small amount, and to have excellent patterning ability because of being hardly condensed due to thermoplastic deformation.;CONSTITUTION: A metal ink composition comprises a metal particle or metal precursor, solvent, and a biogenic adhesive material. The biogenic adhesive material comprises a compound (A) in chemical formula 1, or a compound (B) that the compound (A) is grafted to a backbone which is a water-soluble compound. A forming method of a conductive metal layer comprises: a step of preparing a substrate, a step of spreading the metal ink composition on the substrate; and a step of heat-treating the substrate.;COPYRIGHT KIPO 2012