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Interface bonding properties of multi-layered metal composites using material composition method

机译:使用材料组合物方法的多层金属复合材料的界面粘接性能

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In order to explore the interfacial bonding properties of multi-layered metal composites in depth, using ZChSnSb8-4 alloy as research object, instead of atomic substitution modeling, taking into consideration of the content ratios of Cu6Sn5, SnSb and Sn in the alloy, crystal structure modeling using material composition method was built with molecular dynamics simulation software of Materials Studio, the bonding properties of the interface between steel body and Babbitt alloy with or without Sn layer were simulated and analyzed respectively. The interfacial bonding energy of steel and Babbitt alloy with or without Sn layer was calculated under the same conditions. At the same time, the bonding energy between the adjacent alloy interfaces of the structure with or without Sn layer was calculated and analyzed, the formula for calculating the interface bonding energy of multilayered alloy materials is put forward, and the basis for judging the dangerous interface is given. The simulation results show that the minimum interfacial bonding energy of the three-layer material is 39.92% higher than that of the two-layer material. Therefore, the three-layer structure bushing has better bonding performance and is less likely to be destroyed in engineering practice. Meanwhile, it is demonstrated that when the temperature is 543.15K, the interfacial bonding energy of the bushing is the maximum, and the interfacial bonding performance is the optimal.
机译:为了探讨多层金属复合材料的界面粘合性能深入,使用ZCHSNSB8-4合金作为研究对象,而不是原子替代模拟,考虑到合金中的Cu6SN5,SNSB和Sn的含量比,晶体晶体使用材料组合物的结构建模采用材料工作室的分子动力学模拟软件构建,分别模拟和分析了具有或不具有SN层的钢体和Babbitt合金之间界面的粘接性能。在相同条件下计算钢和Babbitt合金的钢和巴巴特合金的界面粘合能量。同时,计算并分析结构或不具有SN层的结构的相邻合金界面之间的粘合能量,提出了用于计算多层合金材料的界面粘合能量的公式,以及判断危险界面的基础给出。仿真结果表明,三层材料的最小界面粘结能量高于两层材料的39.92%。因此,三层结构衬套具有更好的粘接性能,并且在工程实践中不太可能被破坏。同时,证明当温度为543.15K时,衬套的界面键合能最大,界面粘接性能是最佳的。

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