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METHODS OF MODIFYING SURFACES OF STRUCTURES USED IN THE MANUFACTURE OF A SEMICONDUCTOR DEVICE VIA FLUORINATION
METHODS OF MODIFYING SURFACES OF STRUCTURES USED IN THE MANUFACTURE OF A SEMICONDUCTOR DEVICE VIA FLUORINATION
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机译:通过氟化修饰半导体设备制造中使用的结构表面的方法
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摘要
Methods are disclosed for modifying surfaces of a structure used in manufacturing semiconductor devices wherein the structures are formed from organic polymers. In addition to the surface of the structure, which is over a core, a portion of the structure slightly below the surface is also modified via fluorination of the organic polymer. The fluorination is achieved by exposing the structure to a mixture of gases including fluorine in a range from about 0.01% to about 10% and inert gas comprising a remainder of the mixture of gases. Fluorination occurs from the surface into the core to a depth of no more than about 1 micron and such that a portion of the core below more than 1 micron from the surface is not fluorinated.
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