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FACET-SELECTIVE GROWTH OF NANOSCALE WIRES

机译:纳米线的面部选择性生长

摘要

The present invention generally relates to nanoscale wires, and to systems and methods of producing nanoscale wires. In some aspects, the present invention is generally related to facet-specific deposition on semiconductor surfaces. In one embodiment, a first surface of a nanoscale wire, or a semiconductor, is preferentially oxidized relative to a second surface, and material is preferentially deposited on the second surface relative to the first surface. For example, the nanoscale wire or semiconductor may be a silicon nanowire that is initially exposed to an etchant to remove silicon oxide, then exposed to an oxidant under conditions such that one facet or surface (e.g., a {113} facet) is oxidized more quickly than another facet or surface (e.g., a {111} facet). Material may then be deposited or immobilized on the less-oxidized facet relative to the more-oxidized facet. Other embodiments of the invention may be directed to articles made thereby, devices containing such nanoscale wires or semiconductors, kits involving such nanoscale wires or semiconductors, semiconductor surfaces, or the like.
机译:本发明一般涉及纳米级线,以及涉及生产纳米级线的系统和方法。在某些方面,本发明通常涉及在半导体表面上的刻面特定的沉积。在一个实施例中,相对于第二表面优先氧化纳米级线或半导体的第一表面,并且相对于第一表面优先将材料沉积在第二表面上。例如,纳米级线或半导体可以是硅纳米线,其最初暴露于蚀刻剂以去除氧化硅,然后在使得一个小平面或一个表面(例如,{113}小平面)被更多地氧化的条件下暴露于氧化剂。比另一个构面或表面(例如{111}构面)更快。然后可以相对于较高氧化的小面将材料沉积或固定在较低氧化的小面上。本发明的其他实施例可以针对由此制造的制品,包含这种纳米级线或半导体的装置,涉及这种纳米级线或半导体的套件,半导体表面等。

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