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Chip-Scale Packaged Image Sensor Packages With Black Masking And Associated Packaging Methods
Chip-Scale Packaged Image Sensor Packages With Black Masking And Associated Packaging Methods
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机译:带有黑色掩膜的芯片级封装图像传感器封装及相关封装方法
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摘要
A chip-scale image sensor packaging method with black masking includes (a) cutting a composite wafer having a plurality of image sensors bonded to a common glass substrate to form slots in the common glass substrate, wherein the slots define a cover glass for each of the image sensors, respectively, (b) forming black mask in the slots such that the black mask, for each of the image sensors, spans perimeter of the cover glass as viewed cross-sectionally along optical axis of the image sensors, and (c) dicing through the black mask in the slots to singulate a plurality of chip-scale packaged image sensors each including one of the image sensors and the cover glass bonded thereto, with sides of the cover glass facing away from the optical axis being at least partly covered by the black mask.
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