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SOI WAFER MANUFACTURING PROCESS AND SOI WAFER
SOI WAFER MANUFACTURING PROCESS AND SOI WAFER
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机译:SOI晶圆制造过程和SOI晶圆
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摘要
Provided is an SOI wafer manufacturing method that allows production of an SOI wafer having a high gettering ability and a small resistance variance in a thickness direction of an active layer, at high productivity. The SOI wafer manufacturing method includes a first step of implanting light element ions to a surface of at least one of a first substrate and a second substrate to form, on the at least one of the first substrate and the second substrate, a modified layer in which the light element ions are present in solid solution, a second step of forming an oxide film on a surface of at least one of the first substrate and the second substrate, a third step of bonding the first substrate and the second substrate according to a normal-temperature vacuum bonding method, and a fourth step of obtaining an active layer by thinning the first substrate.
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