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Bumpless die-package interface for bumpless build-up layer (BBUL)
Bumpless die-package interface for bumpless build-up layer (BBUL)
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机译:无凸点裸晶封装接口,用于无凸点积层(BBUL)
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摘要
Embodiments of the present disclosure are directed towards bumpless interfaces to an embedded silicon die, in integrated circuit (IC) package assemblies. In one embodiment, a method includes forming a surrounding portion of dielectric material defining a cavity therein; placing at least one die in the cavity, the die including a contact; depositing a dielectric material on the die and the surrounding portion; etching the dielectric material to expose the contact; and depositing conductive material onto the contact. Other embodiments may be described and/or claimed.
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