BUMPLESS DIE-PACKAGE INTERFACE FOR BUMPLESS BUILD-UP LAYER BBUL

摘要

Embodiments of the present disclosure relate to a bumpless interface to an embedded silicon die in an integrated circuit (IC) package assembly. In one embodiment, the method includes forming a peripheral portion of a dielectric material defining a cavity, disposing at least one die in a cavity, the die including a contact, Depositing a dielectric material, etching the dielectric material to expose the contact, and depositing a conductive material on the contact. Other embodiments may be described and / or claimed.