首页>
外国专利>
Manufacturing method of back illumination CMOS image sensor device using wafer bonding
Manufacturing method of back illumination CMOS image sensor device using wafer bonding
展开▼
机译:利用晶圆键合的背照式CMOS图像传感器的制造方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
Disclosed is a manufacturing method of a semiconductor device including a step of attaching semiconductor wafers together, in which it is prevented that the bonding strength between the attached semiconductor wafers may be decreased due to a void caused between the two semiconductor wafers. Moisture, etc., adsorbed to the surfaces of the semiconductor wafers is desorbed by performing a heat treatment on the semiconductor wafers after cleaning the surfaces thereof with pure water. Subsequently, after a plasma treatment is performed on the semiconductor wafers, the two semiconductor wafers are attached together. The wafers are firmly bonded together by subjecting to a high-temperature heat treatment.
展开▼