Back-side illumination, wafer-scale optics drive 2x-5x jump in CMOS image sensor performance

摘要

It's not just 3D packaging technology where CMOS image sensors are driving IC technology these days. Ultrathin silicon that enables back-side illumination (BSI), and integrated wafer-level optics are bringing sharply improved performance, lower costs, and smaller size, driving CMOS image sensors into more and more markets-and these technologies may soon impact other IC manufacturing as well.