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MOCVD growth of highly mismatched III-V CMOS channel materials on silicon substrates

机译:高度不匹配的III-V CMOS沟道材料在硅衬底上的MOCVD生长

摘要

Embodiments of the present disclosure generally relate to a semiconductor device including layers of group III-V semiconductor materials. In one embodiment, the semiconductor device includes a phosphorous containing layer deposited on a silicon substrate, wherein a lattice mismatch between the phosphorous containing layer and the silicon substrate is less than 5%, a group III-V compound nucleation layer deposited on the phosphorous containing layer at a first temperature, the group III-V compound nucleation layer having a first thickness, a group III-V compound transition layer deposited on the group III-V compound nucleation layer at a second temperature higher than the first temperature, the group III-V compound transition layer having a second thickness larger than the first thickness, and the group III-V compound nucleation layer is different from the group III-V compound transition layer, and an active layer deposited on the group III-V compound transition layer.
机译:本公开的实施例总体上涉及一种包括III-V族半导体材料层的半导体器件。在一个实施例中,半导体器件包括沉积在硅衬底上的含磷层,其中含磷层和硅衬底之间的晶格失配小于5%,沉积在含磷层上的III-V族化合物成核层在第一温度下的第一层,III-V族化合物成核层具有第一厚度,在高于第一温度的第二温度下在III-V族化合物成核层上沉积的III-V族化合物过渡层,III族-V化合物过渡层的第二厚度大于第一厚度,并且III-V族化合物成核层不同于III-V族化合物过渡层,并且活性层沉积在III-V族化合物过渡层上。

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