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Thermal management in electronic apparatus with phase-change material and silicon heat sink
Thermal management in electronic apparatus with phase-change material and silicon heat sink
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机译:具有相变材料和硅散热器的电子设备中的热管理
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摘要
Embodiments of an apparatus with a thermal management technique utilizing a silicon heat sink and/or a phase-change material, as well as an assembling method thereof, are described. In one aspect, the apparatus comprises a main unit, a phase-change material and an enclosure enclosing the main unit and the phase-change material. The main unit comprises a substrate and at least one heat-generating device disposed on the substrate. The phase-change material is in direct contact with each heat-generating device of the at least one heat-generating device to absorb and dissipate heat generated by the at least one heat-generating device.
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