HYDROUS CUTTING FLUID FOR SLICING SILICON INGOT

摘要

A CUTTING FLUID WHICH, IN THE STEP OF CUTTING A SILICON INGOT, IS SUPERIOR TO CONVENTIONAL PRODUCTS IN THE REMOVAL OF PROCESSING HEAT, INFILTRATION PROPERTY, INHIBITION OF REACTION BETWEEN WATER AND THE SILICON, AND ANTI-FOAMING PROPERTY TO THEREBY ATTAIN AN IMPROVEMENT IN CUTTING EFFICIENCY, IS PROVIDED AND WITH WHICH SILICON WAFERS HAVING SATISFACTORY FLATNESS ARE YIELDED. THE ACCURACY OF THE PROCESSED SURFACE CAN BE KEPT HIGH EVEN UNDER SEVERE SLICING CONDITIONS. THE CUTTING FLUID IS A HYDROUS CUTTING FLUID FOR SLICING SILICON INGOT, CHARACTERIZED BY COMPRISING A POLYOXYALKYLENE ADDUCT (A) OF A COMPOUND (A) HAVING 3-8 HYDROXYL GROUPS, THE ADDUCT (A) BEING REPRESENTED BY GENERAL FORMULA (1), AND WATER AS ESSENTIAL COMPONENTS, THE POLYOXYALKYLENE ADDUCT (A) HAVING AN HLB OF 6.0-20.0. R {O-(A1 O) M-H} R (1), WHEREIN IN FORMULA (1), R REPRESENTS THE RESIDUE FORMED BY REMOVING THE HYDROXYL GROUPS FROM A COMPOUND HAVING 3-8 HYDROXYL GROUPS; (A10) REPRESENTS A C2-4 OXYALKYLENE; M, INDICATING THE AVERAGE NUMBER OF MOLES OF A C2-4 ALKYLENE OXIDE WHICH HAS ADDED, IS A NUMBER OF 1 -350; AND F IS AN INTEGER OF 3-8.