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Hydrous cutting fluid for slicing silicon ingot
Hydrous cutting fluid for slicing silicon ingot
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机译:硅片切片用含水切削液
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摘要
The present invention provides a cutting fluid which, in the step of cutting a silicon ingot, is superior to conventional products in the removal of processing heat, infiltrating property, inhibition of reaction between water and the silicon, and antifoaming property to thereby attain an improvement in cutting efficiency, and with which silicon wafers having satisfactory flatness are yielded. The accuracy of the processed surface can hence be kept high even under severe slicing conditions. The cutting fluid is a hydrous cutting fluid for silicon-ingot slicing, characterized by comprising a polyoxyalkylene adduct (A) of a compound (a) having 3-8 hydroxy groups, the adduct (A) being represented by general formula (1), and water as essential components, the polyoxyalkylene adduct (A) having an HLB of 6.0-20.0. R{O-(A1O)m-H}f (1) [In formula (1), R represents the residue formed by removing the hydroxyl groups from a compound having 3-8 hydroxy groups; (A1O) represents a C2-4 oxyalkylene; m, indicating the average number of moles of a C2-4 alkylene oxide which has added, is a number of 1-350; and f is an integer of 3-8.]
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机译:本发明提供了一种切削液,该切削液在切削硅锭的步骤中在消除加工热,渗透性,抑制水与硅之间的反应以及消泡性方面优于常规产品,从而获得了改善。在切割效率方面,可以得到具有令人满意的平坦度的硅晶片。因此,即使在严格的切片条件下,也可以保持加工表面的精度较高。切削液是用于硅片切片的含水切削液,其特征在于,其包含具有3-8个羟基的化合物(a)的聚氧化烯加成物(A),该加成物(A)由通式(1)表示,和水作为必需组分,HLB为6.0-20.0的聚氧化烯加合物(A)。 R {O-(AlO)m-H} f(1)[式(1)中,R表示从具有3-8个羟基的化合物中除去羟基而形成的残基。 (A10)表示C2-4的氧化烯; m表示已添加的C 2-4环氧烷的平均摩尔数,为1-350。并且f是3-8的整数。]
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