Plating bath compositions for non-electrolytic plating of metals and metal alloys

摘要

A non-electrolytic plating bath for the deposition of copper, nickel, cobalt or its alloys comprising at least one source of metal ions and at least one reducing agent, characterized in that the non-electrolytic plating bath further comprises a plating rate modifier according to formula (I) ** Formula ** in which the monovalent residues of R1 to R2, the terminal group Y and a divalent separator group Z and an index n are selected from the following groups - R1 is selected from the group consisting of -O-R3 and -NH-R4 in which R3 is selected from hydrogen, lithium, sodium, potassium, rubidium, cesium, ammonium, alkyl, aryl, and R4 is selected from hydrogen, alkyl and aryl; - R2 is selected from the group consisting of hydrogen, alkyl, alkylaryl and aryl; - And it is selected from the group consisting of ** Formula ** in which the monovalent moiety R1 'is selected from the group consisting of -O-R3' and -NH-R4 'in which R3' is selected from hydrogen, lithium, sodium, potassium, rubidium, cesium, ammonium, alkyl, aryl and R4 'is selected from hydrogen, alkyl and aryl and the monovalent moiety R2' is selected from the group consisting of hydrogen, alkyl, alkylaryl and aryl and n 'is a integer ranging from 1 to 2; ** Formula ** - Z is ** Formula ** in which R5 to R8 are saturated unbranched alkylene moieties in which the individual hydrogen attached to said unbranched saturated alkylene moieties in each case 20 is optionally substituted with a functional group selected from alkyl, aryl and hydroxyl (-OH); where p is an integer that varies from 1 to 100, q is an integer that varies from 0 to 99, r is an integer that varies from 0 to 99, s is an integer that varies from 0 to 99 with the proviso that the sum of (p + q + r + s) varies from 1 to 100; and - n is an integer that varies from 1 to 2.