Provided is a paste thermosetting resin composition which does not inhibit melting and aggregation of a soldering powder during soldering. This paste thermosetting resin composition contains a soldering powder, a thermosetting resin binder, an activator, and a thixotropic additive, the melting point of the soldering powder being 100°C to 240°C, and the thermosetting resin binder including a bifunctional or greater oxetane compound and/or a benzoxazine compound having two or more benzoxazine rings.
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