PASTE THERMOSETTING RESIN COMPOSITION, SEMICONDUCTOR COMPONENT, SEMICONDUCTOR MOUNTED ARTICLE, METHOD FOR MANUFACTURING SEMICONDUCTOR COMPONENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR MOUNTED ARTICLE

摘要

Provided is a paste thermosetting resin composition containing solder powder, a thermosetting resin binder, an activator, and a thixotropy imparting agent. The solder powder has a melting point ranging from 100° C. to 240° C., inclusive. The thermosetting resin binder contains a main agent and a curing agent. The main agent contains a di- or higher functional oxetane compound.