WAFER POLISHING METHOD, BACK PAD MANUFACTURING METHOD, BACK PAD, AND POLISHING HEAD PROVIDED WITH BACK PAD

摘要

The present invention is a wafer polishing method wherein the rear surface of a wafer is held by a polishing head via a back pad adhered to the polishing head, and the front surface of the wafer is polished by having the front surface in slidably contact with a polishing cloth adhered on a surface plate. As the back pad, a pad, which has a base material layer adhered to the polishing head, and a nap layer that holds the rear surface of the wafer by being in contact with the rear surface, is used, said base material layer being formed of a glass epoxy resin or a cellulose resin. Consequently, provided is the wafer polishing method whereby, without making the thickness of the back pad of the polishing head excessively large, load can be uniformly applied to the wafer by suppressing warping of the back pad, and as a result, the wafer having high planarity can be obtained.