An RFID tag (101) is provided with: a circuit board (1) having a first surface (S1) and a second surface (S2) facing the first surface, a conductor pattern being formed on the circuit board (1); an electronic component mounted on the first surface (S1) of the circuit board (1), the electronic component constituting a module circuit with the conductor pattern; a resin layer (2) for sealing the electronic component; and a magnetic body member (3) overlapping on the first surface (S1) of the circuit board (1). A laminate (123) is constituted from the circuit board (1), the resin layer (2), and the magnetic body member (3), and a conductor coil (4) connected to the module circuit is wound in a direction bundling the laminate (123) around the laminate (123).
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