ADVANCEDLY STRENGTHENED ELECTRICAL INTERCONNECTIONS FOR SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME

摘要

The present invention relates to an electrical connection portion having enhanced rigidity of a semiconductor device having enhanced rigidity and a method of forming the same, And a wire loop having a tip. The second bonding includes a folding portion extending from a second end of the wire loop and having a wire folded over the second bonding point. Wherein the folding portion includes a first folding portion connected to a second end of the wire loop and extending toward the first bonding point, a second folding portion provided on the first folding portion, and a second folding portion provided on a tail portion of the second folding portion, . The lower surface of the second folding portion forms an interface with the first folding portion. The upper surface of the second folding portion includes an inclined surface recessed toward the first folding portion.