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Al2O3 ATOMIC LAYER ETCHING OF Al2O3 USING A COMBINATION OF PLASMA AND VAPOR TREATMENTS

机译:等离子体与蒸气处理相结合的Al2O3原子层刻蚀

摘要

A method for performing atomic layer etching (ALE) on a substrate comprises: a step of performing a surface modification operation on a substrate surface to convert at least one monolayer of the substrate surface into a modified layer; a step of performing a removal operation on the substrate surface to remove the modified layer from the substrate surface through ligand-exchange reaction configured to volatilize the modified layer; a step of performing plasma treatment on the substrate surface after the removal operation, which is to remove residues generated by the removal operation from the substrate surface such that the residues are volatilized by the plasma treatment; and a step of repeating the operations until the substrate surface is etched by a predetermined thickness.
机译:一种用于在基板上执行原子层蚀刻(ALE)的方法,包括:在基板表面上执行表面改性操作以将基板表面的至少一个单层转化为改性层的步骤;在基板表面上进行去除操作以通过被配置为使改性层挥发的配体交换反应从基板表面去除改性层的步骤;去除工序后,对基板表面进行等离子体处理的步骤,该工序是将去除工序中产生的残渣从基板表面去除,使残渣通过等离子体处理而挥发的工序。以及重复上述操作直到基板表面被蚀刻预定厚度的步骤。

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