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COMPOSITION FOR FORMING RESIST UNDERCOAT METHOD FOR FORMING RESIST UNDERCOAT AND PATTERNING PROCESS

机译:形成抗蚀底涂层的方法形成抗蚀底涂层的方法

摘要

An object of the present invention is to provide a resist underlayer film material of a multilayer resist film used in lithography, which is excellent in step-gap filling property of a substrate, has solvent resistance and does not cause twisting during etching of a substrate, A composition for forming a resist lower layer film for forming a lower layer film, a method for forming a resist lower layer film using the same, and a pattern forming method are provided.(A) obtained by condensing at least a compound represented by the following formula (1) and a compound represented by the following formula (2) with an acid catalyst, a compound (B) represented by the following formula (1), a fullerene compound And a composition for forming a resist lower layer film. Formula (1) Formula 2 ;
机译:本发明的目的是提供一种用于光刻的多层抗蚀剂膜的抗蚀剂下层膜材料,其在基板的阶梯间隙填充性方面优异,具有耐溶剂性并且在蚀刻基板时不引起扭曲,提供了一种用于形成用于形成下层膜的抗蚀剂下层膜的组合物,用于形成该抗蚀剂下层膜的方法,以及用于形成该抗蚀剂下层膜的方法的图案形成方法。(A)通过使至少一种由所述化合物表示的化合物缩合而获得。下式(1)和下式(2)表示的化合物与酸催化剂,下式(1)表示的化合物(B),富勒烯化合物和用于形成抗蚀剂下层膜的组合物。公式(1)> <公式2>;

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