The present invention provides a method of fabricating a microelectronic structure for reducing reflection from a substrate during exposure and a structure formed by such a method using a double layer, photosensitive wet-developable bottom anti-reflective coating stack. The present invention provides dye-fill and dye-adhering compositions for use in anti-reflective coatings. The anti-reflective coating is thermally crosslinkable and is photochemically deblockable. The bottom anti-reflective coating stack has progressive optical properties and is developed simultaneously with the photoresist. The above methods and structures are particularly suitable for high-NA lithography processes.
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