Film of test socket fabricated by MEMS technology having improved contact bump

摘要

The MEMS film for a test socket according to the present invention is disposed between a semiconductor device and a test device and performs electrical inspection of the semiconductor device. The MEMS film for a test socket includes a flexible bare film, Type, round-type, which forms an electrical contact with an electrode pad of the test apparatus or a conductive ball of the semiconductor device, the contact surface of which is convexly rounded toward the electrode pad or the conductive ball toward the center from the edge, Of MEMS bumps. According to such a configuration, the contact property is greatly improved.