Hybrid test socket fabricated by MEMS technology having wire silicon rubber thereby improving contact characteristic

摘要

The hybrid test socket of the present invention includes a test MEMS film disposed between a semiconductor device and a test device to perform an electrical inspection of the semiconductor device and a semiconductor device mounted on the MEMS film, RTI ID = 0.0 silicon /RTI According to the structure of the present invention, the contact properties of the MEMS film are improved by the wire silicon board.