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Nano-dispersion strengthened gold films for MEMS electrical contacts.

机译:用于MEMS电触点的纳米分散增强金膜。

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摘要

Thin gold films were strengthened with a uniform dispersion of zirconia nanoparticles. The purpose of strengthening the films was to resist small-scale surface plastic deformation of microswitches' contacts and transmission line, which can lead stiction, a microswitch failure mechanism. Deposited by reactive ion sputtering of an Au-Zr target, the films were comprised of a columnar gold matrix with a diameter of 50 nm and a nano-dispersion of zirconia particles 1--3 nm in diameter. These films were studies in the as-sputtered and annealed (500°C) states. For reference, assputtered and annealed pure gold films sputtered under similar conditions were also studied. The microstructures of the films were determined using TEM and AFM. The annealed nano-composite film showed no sign of coarsening of either the columnar gold grains or the zirconia nanoparticles. Though, the columnar grains of the pure gold film grew substantially upon annealing (100 nm to ∼ 1 microm).;The incorporation of the nanoparticles was shown to have an improvement in resistance to plasticity and creep deformation. Nanoindentation results have shown that the nano-composite films are twice as hard as the pure gold films. The increase in hardness was attributed to the nanoparticles as well as a smaller gold grain size, a higher point defect density, and a higher growth-twin density in the nano-composite. Hemispherical indentation experiments have shown that the surface topology of the nano-composite is better at resisting time-independent and timedependent plastic deformation indicating that the nano-composite films are more creep resistant than the pure gold films. The resistivity of the nanocomposite film was measured to be 1.5 times the resistivity of the gold film, and the microstructural features attributed to increasing the resistivity of the nanocomposite are the same as those attributed to increasing its hardness.;Microswitches with contacts and transmission lines comprised of nano-composite and gold were fabricated to investigate the materials resistance to contact stiction and the switches' resistance. Stiction was not seen in the nano-composite switch even at twice the load that stiction occurred in the gold switch. The resistance of the nano-composite switch was 3.7 times the resistance of the gold switch.
机译:氧化锆纳米颗粒的均匀分散增强了金薄膜。增强薄膜的目的是为了抵抗微动开关触点和传输线的小范围表面塑性变形,这种变形会导致微动开关失效的机理。通过Au-Zr靶的反应性离子溅射沉积,所述膜由直径为50nm的圆柱状金基质和直径为1-3nm的氧化锆颗粒的纳米分散体组成。在溅射和退火(500℃)状态下研究了这些膜。作为参考,还研究了在类似条件下溅射和退火的纯金膜。使用TEM和AFM确定膜的微观结构。退火的纳米复合膜没有显示出柱状金颗粒或氧化锆纳米颗粒的粗化迹象。虽然,纯金膜的柱状晶粒在退火(100 nm至〜1微米)时会基本生长。纳米颗粒的掺入显示出可塑性和蠕变变形的改善。纳米压痕结果表明,纳米复合膜的硬度是纯金膜的两倍。硬度的增加归因于纳米颗粒以及纳米复合材料中较小的金晶粒尺寸,较高的点缺陷密度和较高的孪生密度。半球形压痕实验表明,纳米复合材料的表面拓扑结构在抵抗时间无关和时间依赖性塑性变形方面表现更好,这表明纳米复合材料薄膜比纯金薄膜具有更高的抗蠕变性。纳米复合膜的电阻率经测量为金膜电阻率的1.5倍,归因于提高纳米复合材料的电阻率的微观结构特征与归因于其硬度增加的微观结构特征相同;具有触点和传输线的微动开关制备了纳米复合材料和金纳米管,以研究材料的接触摩擦阻力和开关的电阻。在纳米复合材料开关中甚至在金开关中出现静摩擦的两倍的负载下也看不到静摩擦。纳米复合开关的电阻是金开关的电阻的3.7倍。

著录项

  • 作者

    Williams, Jesse Robert.;

  • 作者单位

    University of California, Santa Barbara.;

  • 授予单位 University of California, Santa Barbara.;
  • 学科 Engineering Materials Science.
  • 学位 Ph.D.
  • 年度 2008
  • 页码 214 p.
  • 总页数 214
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 工程材料学;
  • 关键词

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