2 Apparatus For Plating PCB Can Plate More Than Two Kinds Of Plating in One System

摘要

The present invention relates to an apparatus for plating a printed circuit board capable of performing nickel plating, silver plating, and gold plating in a single system. The apparatus for plating a printed circuit board comprises: a pretreatment unit to degrease and wash a surface of a plating target of various circuit board forms; a first plating unit to firstly plate the plating target passing through the pretreatment unit with nickel; a second plating unit which is installed on a main line connected to the first plating unit, and secondly performs second plating on the plating target passing through the first plating unit; a third plating unit installed on a sub-line installed in parallel with the main line, and installed in parallel with the second plating unit to secondly perform third plating on the plating target passing through the first plating unit; a branch transport unit to allow the plating target passing through the first plating unit to branch to be transported to the sub-line; a post-treatment unit to perform a post-treatment on the plating target passing through the second and the third plating unit to complete plating; and a withdrawal unit to withdraw the plating target passing through the post-treatment unit.