The effect of waveform for pulse plating on copper plating distribution of microvia in PCB manufacture

摘要

The application of microvias is to reduce the size and weight of the printed circuit board, and to enhance its electrical performance. In many instances, the plating of microvias creates a bottleneck for High Density Interconnection (HDI) manufacture. In this study, the effects of waveform on the copper plating process were investigated. The results showed that the addition of a spike, and a decrease in forward current can improve the throwing power in plating quality. The study also found that the combination of multiple spikes, a low forward current and a high reverse current can significantly improve copper distribution in microvias plating.