EFFECTS OF PLATING RACK DESIGN AND VIBRATION FREQUENCY ON DISPLACEMENT UNIFORMITY DURING PCB COPPER PLATING UNDER MECHANICAL VIBRATION

摘要

Printed Circuit Board (PCB) industry is currently looking for new avenues to improve small copper plating interconnections and, amongst them, PCB mechanical vibration constitutes a promising solution. The aim of the work described in the present paper is to study the effects of plating rack design and vibration frequency on displacement uniformity during PCB copper plating under mechanical excitation. A special clamping device was engineered to properly transmit vibration together with keeping the PCB in place. Through displacement measurements, it was also demonstrated by using a two-impact frequencies excitation system, that vibration uniformity was improved on both the PCB surface and alongside the bus bar.