DPMDirect Pattern Method PCB LED Assembled LED Device of DMP Type without PCB and Housing and Method thereof

摘要

According to the DPM (Direct Pattern Method) method of the present invention, a method of manufacturing an integrated LED light without a PCB substrate and a housing uses an insulating paste containing a low melting point glass frit and an inorganic oxide directly on an aluminum heat sink base without a PCB substrate obstructing heat conduction Forming a thin ceramic insulating layer on the ceramic insulating layer to form a sintering thermal fusion bond at a temperature of 500 to 600 ° C. and forming a ceramic insulating layer A step of forming a sintering thermal fusion at a temperature of 450 ° C to 550 ° C after printing an electric circuit silver pattern on an upper portion of the electric circuit silver pattern; (UV) or a thermosetting method after the protective film is printed on the remaining portions except for a plurality of LEDs (SMT) of a power connector and a waterproof wire harness; inserting the waterproof wire harness into the power connector and inserting the waterproof wire harness rubber through the center hole of the aluminum heat dissipation base; Assembling a waterproof casket to a PC or a tempered glass cover frame groove; and attaching a PC or tempered glass cover having a waterproof gasket to the upper part of the LED lighting unit including the aluminum heat-dissipating base And screwing and assembling the LED lighting unit and the angle adjusting bracket with a screw bolt.