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- - RULE-BASED SEMICONDUCTOR DIE STACKING AND BONDING WITHIN A MULTI-DIE PACKAGE
- - RULE-BASED SEMICONDUCTOR DIE STACKING AND BONDING WITHIN A MULTI-DIE PACKAGE
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机译:--多芯片封装中基于规则的半导体芯片堆叠和键合
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摘要
A rule-based method is disclosed for optimizing wire-bonding jumps, which method minimizes the amount of wires used for wire bonds and / or supports all connections being wired, Thereby minimizing the number of power and ground pads on the substrate.
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