Optoelectronic semiconductor component, optoelectronic assembly and method for producing an optoelectronic semiconductor component

摘要

An optoelectronic semiconductor device comprises an optoelectronic semiconductor chip (C1) having an electrically conductive carrier (T), an active part (AT) containing epitaxially grown layers, and an intermediate layer (ZS) sandwiched between the carrier (T) and the active layer Part (AT) is arranged and contains a solder material. The optoelectronic semiconductor component further comprises an electrical connection point which at least partially covers an underside of the carrier (T), wherein the electrical connection point on a side facing the carrier (T) comprises a first contact layer (KS1) and the first contact layer (KS1) contains aluminum or made of aluminum.