首页> 外国专利> METHOD FOR REMOVING WORK-AFFECTED LAYER OF SIC SEED CRYSTAL, AND SIC SUBSTRATE MANUFACTURING METHOD

METHOD FOR REMOVING WORK-AFFECTED LAYER OF SIC SEED CRYSTAL, AND SIC SUBSTRATE MANUFACTURING METHOD

机译:SIC种子晶体的影响加工层的去除方法以及SIC基质制造方法

摘要

Provided is a method in which the rate of growth is not lowered even when a cut SiC seed crystal is used in performing MSE process. A SiC seed crystal that is used as a seed crystal in metastable solvent epitaxy process (MSE process) is heated under Si atmosphere and the surface of the SiC seed crystal is etched to remove a work-affected layer that was formed by cutting. Work-affected layers generated on SiC seed crystals are known to inhibit growth during MSE process, and therefore removing the work-affected layers can prevent lowering of the rate of growth.
机译:提供一种即使在进行MSE工艺中使用切割的SiC晶种时也不会降低生长速率的方法。在Si气氛下加热在亚稳溶剂外延工艺(MSE工艺)中用作晶种的SiC晶种,并对SiC晶种的表面进行蚀刻以去除通过切割形成的工件影响层。已知在SiC晶种上产生的受工作影响的层会抑制MSE过程中的生长,因此去除受工作影响的层可以防止生长速率的降低。

著录项

  • 公开/公告号EP3128047B1

    专利类型

  • 公开/公告日2018-09-26

    原文格式PDF

  • 申请/专利权人 TOYO TANSO CO. LTD.;

    申请/专利号EP20150773120

  • 申请日2015-03-10

  • 分类号H01L21/3065;H01L21/302;H01L21/324;H01L21/205;H01L21/67;C30B19/04;C30B19/12;C30B29/36;C30B33/12;H01L21/02;H01L29/16;

  • 国家 EP

  • 入库时间 2022-08-21 13:19:40

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