In one aspect of the present disclosure, there is provided an adhesive precursor, comprisinga first part (A) comprising:a first epoxy curing agent comprising at least one polyether amine and having an amine equivalent weight of at least 55 grams per mole of amine equivalents;a second epoxy curing agent distinct from the first epoxy curing agent or a secondary curative;a metal salt catalyst; andoptionally, a toughening agent;a second part (B) comprising:a first epoxy resin;a second epoxy-based resin distinct from the first epoxy resin;at least one phosphorous-based first flame retardant;a core-shell polymer toughening agent;optionally an epoxy-based reactive diluent; andoptionally, a filler material;wherein the total amount of the flame retardant system is lower than 25 wt.-% of the total curable adhesive precursor.
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