PROBLEM TO BE SOLVED: To obtain a curing agent composition for a flame-retardant epoxy resin, which contains neither a halogen compound nor an antimony compound, provides an epoxy resin composition with excellent flame retardance, improved curability, fluidity and preservability and an epoxy resin composition having the excellent properties and to provide a semiconductor apparatus having excellent solder crack resistance and reliability of moisture resistance.;SOLUTION: The curing agent composition for a flame-retardant epoxy resin comprises a phenolic hydroxy group-containing compound (A) and an iron compound (B) containing at least one or more kinds of bonds of an ionic bond between an iron atom and a phenoxide group, a coordinate bond between an iron atom and an oxygen atom of a carbonyl group and a coordinate bond between an iron atom and an oxygen atom of a sulfone group and is obtained by mixing under heating at the softening temperature of the compound (A) containing two or more phenolic hydroxy groups in one molecule or above.;COPYRIGHT: (C)2004,JPO&NCIPI
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