首页> 外国专利> STACKED MODULE, STACKING METHOD, COOLING POWER FEEDING MECHANISM, AND STACKED MODULE MOUNTING SUBSTRATE

STACKED MODULE, STACKING METHOD, COOLING POWER FEEDING MECHANISM, AND STACKED MODULE MOUNTING SUBSTRATE

机译:堆叠模块,堆叠方法,冷却功率馈送机制以及堆叠模块安装基板

摘要

PROBLEM TO BE SOLVED: To solve such a problem that implementation of countermeasures against voltage drop is difficult without increasing the size of a stacked module when stacked mounting is performed.SOLUTION: A stacked module includes a plurality of substrates on which components are mounted; a connection component for electrically connecting substrates in a state where the substrates are stacked; and a power feeding cooling mechanism in which power is fed to the plurality of substrates and the components mounted on the plurality of substrates are cooled. Or the cooling power feeding mechanism is inserted between the plurality of substrates electrically connected to each other in an overlapped state and includes a cooling member which comes into contact with the components mounted on the substrates to cool the components; and a power feeding member which comes into contact with the substrates to feed power to the substrates.SELECTED DRAWING: Figure 2
机译:解决的问题:为了解决这样的问题:在执行堆叠安装时,在不增加堆叠模块的尺寸的情况下,难以实施针对电压降的对策。解决方案:堆叠模块包括:多个基板,其上安装有组件;连接部件,用于在堆叠基板的状态下电连接基板;供电冷却机构,在该供电冷却机构中,对多个基板进行供电,并冷却安装在多个基板上的部件。或者,冷却电力供给机构以重叠的状态插入在相互电连接的多个基板之间,并具有与安装在基板上的部件接触并进行冷却的冷却部件。图2是与基板接触并向基板供电的供电部件。

著录项

  • 公开/公告号JP2018152534A

    专利类型

  • 公开/公告日2018-09-27

    原文格式PDF

  • 申请/专利权人 NEC CORP;

    申请/专利号JP20170049683

  • 发明设计人 NEDACHI TAKAAKI;

    申请日2017-03-15

  • 分类号H01L23/36;H01L25/065;H01L25/07;H01L25/18;H01L23/12;H05K1/14;H05K7/20;

  • 国家 JP

  • 入库时间 2022-08-21 13:13:13

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号