SOLUBLE COPPER ANODE, ELECTROLYTIC COPPER PLATING APPARATUS, ELECTROLYTIC COPPER PLATING METHOD, AND STORAGE METHOD OF ACIDIC ELECTROLYTIC COPPER PLATING LIQUID

摘要

PROBLEM TO BE SOLVED: To provide a soluble copper anode, an electrolytic copper plating apparatus, an electrolytic copper plating method, and a storage method of an acidic electrolytic copper plating liquid, which can stably suppress production of an anode sludge.SOLUTION: A soluble copper anode that is used for electrolytic copper plating adopts a soluble copper anode that includes a titanium case for housing a copper material and an iridium oxide member in contact with the titanium case. Here, in the iridium oxide member, at least a surface material is an iridium oxide simple substance or an iridium oxide composite, and thereby production of an anode sludge can be suppressed, and the plating property is not degraded.SELECTED DRAWING: Figure 1