Soluble copper anode, electrolytic copper plating apparatus, electrolytic copper plating method and preservation method of acid electrolytic copper plating solution

摘要

An electrolytic copper plating apparatus, an electrolytic copper plating method, and a method of preserving an acidic electrolytic copper plating liquid, which can stably inhibit the generation of an anode sludge. In order to achieve this object, there is employed a soluble copper anode comprising a titanium case containing a copper material and an oxidized iridium member contacting the titanium case, as a soluble copper anode to be used for electrolytic copper plating. Here, the iridium oxide member is made of iridium oxide alone or iridium oxide composite at least on the surface thereof, so that the generation of the anode sludge is suppressed and the plating property is not deteriorated.