DICING TAPE, DICING/DIE-BONDING DOUBLE FUNCTIONING TAPE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD BY USE OF DICING/DIE-BONDING DOUBLE FUNCTIONING TAPE

摘要

PROBLEM TO BE SOLVED: To provide a dicing tape which can adequately suppress the chip skipping, and allows individual chips to be picked up adequately even with a small rising amount in a pickup step subsequent after that in dicing a semiconductor wafer into small-size chips.;SOLUTION: A dicing/die-bonding double functioning tape 1 comprises a base material layer 10, an adhesive layer 20, and an adhesive layer 30 which are laminated in this order. A dicing tape is to be used as the base material layer 10 and the adhesive layer 20 in the dicing/die-bonding double functioning tape. In the dicing tape, a rupture elongation of the adhesive layer 20 before exposure to light is over 140% up to 200%.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2018,JPO&INPIT