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Material deposition system and method for depositing material in a material deposition system

机译:材料沉积系统和用于在材料沉积系统中沉积材料的方法

摘要

A vacuum deposition system (300; 400; 500) for depositing material on a substrate (121) is described. The vacuum deposition system (300; 400; 500) includes a vacuum chamber (110) having a chamber volume and a material deposition apparatus (100) for providing a material to be deposited, the vacuum chamber (110) being deposited. And a material deposition apparatus (100) disposed therein. The vacuum deposition system further includes a substrate support (126; 600) for supporting a substrate (121) having a substrate size within the vacuum chamber (110). The ratio of the chamber volume to the substrate size is 15 m or less. Further described is a method of depositing material on a substrate (121) in a vacuum deposition system (300; 400; 500). [Selection] Figure 1a
机译:描述了一种用于在衬底(121)上沉积材料的真空沉积系统(300; 400; 500)。真空沉积系统(300; 400; 500)包括具有腔室容积的真空室(110)和用于提供待沉积材料的材料沉积设备(100),该真空室(110)被沉积。以及布置在其中的材料沉积设备(100)。真空沉积系统还包括用于在真空室(110)内支撑具有基板尺寸的基板(121)的基板支撑件(126; 600)。腔室容积与基板尺寸的比率为15m或更小。进一步描述了在真空沉积系统(300; 400; 500)中在衬底(121)上沉积材料的方法。 [选择]图1a

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