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Doping of substrate via dopant containing polymer film

机译:通过含掺杂剂的聚合物薄膜掺杂衬底

摘要

Disclosed herein is a method for doping a substrate, comprising disposing a coating of a composition comprising a dopant-containing polymer and a non-polar solvent on a substrate; and annealing the substrate at a temperature of 750 to 1300° C. for 1 second to 24 hours to diffuse the dopant into the substrate; wherein the dopant-containing polymer is a polymer having a covalently bound dopant atom; wherein the dopant-containing polymer is free of nitrogen and silicon; and wherein the method is free of a step of forming an oxide capping layer over the coating prior to the annealing step.
机译:本文公开了一种掺杂衬底的方法,该方法包括:将包含含掺杂剂的聚合物和非极性溶剂的组合物的涂层布置在衬底上;在750〜1300℃的温度下退火1秒〜24小时,使掺杂剂扩散到基板中。其中含掺杂剂的聚合物是具有共价键合的掺杂剂原子的聚合物;其中含掺杂剂的聚合物不含氮和硅。并且其中该方法没有在退火步骤之前在涂层上形成氧化物覆盖层的步骤。

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