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DOPING OF A SUBSTRATE VIA A DOPANT CONTAINING POLYMER FILM

机译:通过包含聚合物薄膜的掺杂剂对基质进行浸渍

摘要

Disclosed herein is a method for doping a substrate, comprising disposing a coating of a composition comprising a copolymer, a dopant precursor and a solvent on a substrate; where the copolymer is capable of phase segregating and embedding the dopant precursor while in solution; and annealing the substrate at a temperature of 750 to 1300° C. for 0.1 second to 24 hours to diffuse the dopant into the substrate. Disclosed herein too is a semiconductor substrate comprising embedded dopant domains of diameter 3 to 30 nanometers; where the domains comprise Group 13 or Group 15 atoms, wherein the embedded spherical domains are located within 30 nanometers of the substrate surface.
机译:本文公开了一种掺杂衬底的方法,该方法包括:将包含共聚物,掺杂剂前体和溶剂的组合物的涂层布置在衬底上;当共聚物在溶液中时能够相分离和嵌入掺杂剂前体;然后在750〜1300℃的温度下对基板进行0.1秒〜24小时的退火,以将掺杂剂扩散到基板中。本文还公开了一种半导体衬底,其包括直径为3至30纳米的嵌入的掺杂剂域;该掺杂剂域包括:其中所述域包含第13族或第15族原子,其中所述嵌入的球形域位于所述基底表面的30纳米内。

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